BST-A9 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone 6s/6s Plus
Price:
$ 9.58
Free Shipping
For just $ 9.58 , buy BST-A9 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone 6s/6s Plus from the wholesale webshop online.
Specifications
Product Description
Specifications
Condition | OEM |
---|---|
Parts Type | Others |
Gross Weight | 0.011kg |
Volume Weight | 0.009kg |
Length | 10.000cm |
Width | 8.000cm |
Height | 0.500cm |
Weight | 0.010kg |
With Retail Packaging | Yes |
Product Description
BST-A9 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone 6s/6s Plus
-
Made by high quality steel material
-
The stepped grooves can quickly adjust the tin sweating location of IC beads
-
Easy and quickly for reballing the BGA IC
-
Excellent to replace IC or BGA rework reballing
Package included:
- 1 x BST-A9 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template