MiJing Z16 BGA Reballing fixture for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch

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$ 20.74

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Specifications

Retail Packaging Colored Box
User Manual (Language) No User Manual
Gross Weight 0.246kg
Volume Weight 0.202kg
Length 15.000cm
Width 12.000cm
Height 5.000cm
Weight 0.220kg
With Retail Packaging Yes

Product Description

MiJing Z16 BGA Reballing fixture for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch

MJ 2 in 1 BGA Reballing Stencil Platform Jig Fixure is professional BGA Reballing Stencil Fixture for iPhone 11pro, iPhone 11pro motherboard BGA reballing fixture tool, is used for positioning and reballing iPhone 11pro PCB BGA parts, convenient and faster for reballing BGA without any damage, offer you best solution for iPhone 11 pro BGA reballing and repairing.

  • Install the iPhone 11 pro main board on the platform

  • Cover the iPhone 11 pro BGA reballing stencil on mainboard

  • Evenly spread tin on the cover of the reballing stencil

  • Remove the reballing stencil cover

  • Take out the motherboard and cooperate with the hot air gun to solidify the tin point

Compatible with:

  • iPhone 11 Pro 5.8 inch

  • iPhone 11 Pro Max 6.5 inch

Package included:

  • 1 x MiJing Z16 BGA Reballing fixture for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch
MiJing Z16 BGA Reballing fixture for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch-1
MiJing Z16 BGA Reballing fixture for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch-2
MiJing Z16 BGA Reballing fixture for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch-3
MiJing Z16 BGA Reballing fixture for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch-4
MiJing Z16 BGA Reballing fixture for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch-5