BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
Price:
$ 1.94
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For just $ 1.94 , buy BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9 from the wholesale webshop online.
Specifications
Product Description
Specifications
| Condition | OEM |
|---|---|
| Parts Type | Others |
| Gross Weight | 0.011kg |
| Volume Weight | 0.009kg |
| Length | 10.000cm |
| Width | 8.000cm |
| Height | 0.500cm |
| Weight | 0.010kg |
| With Retail Packaging | Yes |
Product Description
BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
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Made by high quality metal material
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Easy and quickly for reballing the BGA IC
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Excellent to replace IC or BGA rework reballing
Package included:
- 1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9