BST-A12 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone XS/XS Max/XR

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$ 9.58

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Specifications

Condition OEM
Parts Type Others
Gross Weight 0.011kg
Volume Weight 0.009kg
Length 10.000cm
Width 8.000cm
Height 0.500cm
Weight 0.010kg
With Retail Packaging Yes

Product Description

BST-A12 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone XS/XS Max/XR

  • Made by high quality steel material

  • The stepped grooves can quickly adjust the tin sweating location of IC beads

  • Easy and quickly for reballing the BGA IC

  • Excellent to replace IC or BGA rework reballing

Package included:

  • 1 x BST-A12 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template
BST-A12 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone XS/XS Max/XR-1