BST-A10 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone 7/7 Plus
Price:
$ 9.58
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For just $ 9.58 , buy BST-A10 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone 7/7 Plus from the wholesale webshop online.
Specifications
Product Description
Specifications
| Condition | OEM |
|---|---|
| Parts Type | Others |
| Gross Weight | 0.011kg |
| Volume Weight | 0.009kg |
| Length | 10.000cm |
| Width | 8.000cm |
| Height | 0.500cm |
| Weight | 0.010kg |
| With Retail Packaging | Yes |
Product Description
BST-A10 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone 7/7 Plus
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Made by high quality steel material
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The stepped grooves can quickly adjust the tin sweating location of IC beads
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Easy and quickly for reballing the BGA IC
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Excellent to replace IC or BGA rework reballing
Package included:
- 1 x BST-A10 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template