BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X
Price:
$ 8.51
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For just $ 8.51 , buy BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X from the wholesale webshop online.
Specifications
Product Description
Specifications
| Condition | OEM |
|---|---|
| Parts Type | Others |
| Gross Weight | 0.034kg |
| Volume Weight | 0.072kg |
| Length | 10.000cm |
| Width | 8.000cm |
| Height | 4.000cm |
| Weight | 0.030kg |
| With Retail Packaging | Yes |
Product Description
BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X
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Made by high quality steel material
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The stepped grooves can quickly adjust the tin sweating location of IC beads
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Easy and quickly for reballing the BGA IC
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Excellent to replace IC or BGA rework reballing
Package included:
- 1 x BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template