1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools – Diameter: 0.65mm
Price:
$ 2.19
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For just $ 2.19 , buy 1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools – Diameter: 0.65mm from the wholesale webshop online.
Specifications
Product Description

Specifications
ColorStyle | A |
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Retail Packaging | No Package |
User Manual (Language) | No User Manual |
Gross Weight | 0.017kg |
Volume Weight | 0.002kg |
Length | 3.500cm |
Width | 1.600cm |
Height | 1.600cm |
Weight | 0.015kg |
With Retail Packaging | Yes |
Product Description
1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools – Diameter: 0.65mm
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Brand new and high quality
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Solder tin paste is the best choice of reballing IC
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It is used instead of the pin in the IC component package structure
Specification:
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Brand: BEST
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Model: 505
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Material: tin
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Diameter: 0.2mm~0.65mm
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Flux content: 63%
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Melting point: 183°C
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Working temperature: 200-380°C
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Quantity: 25,000pcs per bottle
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Balls alloy: Sn63/Pb37
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Size: 35x16mm
Package included:
- 1 x 1 Bottle Tin BGA Reballing Soldering Balls

