For iPhone X G-LON Original Middle Layer BGA Reballing Fixture Stencil Plant Tin Platform

This set of tools solve the problem of the low success rate of traditional mainboard repair

There is no difference between this product and the original average tin layer, the tin melting area of the CPU is slightly smaller than that of surrounding

This solder paste uses the principle of temperature difference, easily blow out CPU without touching peripheral accessories.

Within the temperature difference fine, it makes all maintenance of efficiency improved greatly

Even someone without experience can plant tin perfectly